Type U-01 SMD spring contact for PCB surface mount grounding and EMI shielding applications. The Precision-formed spring geometry provides consistent contact force for reliable EMI suppression — suitable for shielding cans, RF modules, and PCB-to-enclosure grounding.
Tape-and-reel packaged for automated SMT pick-and-place — compatible with standard reflow soldering processes and production lines.
Type U spring profile delivers reliable electrical contact between PCB pad and metal enclosure for consistent EMI suppression performance.
Provides a low-resistance grounding path from PCB to chassis or housing — the spring returns the same contact force at a given working height, without taking a permanent set.
Precision-formed spring geometry ensures consistent contact force against the mating surface for reliable electrical continuity.
Type U geometry suited to space-constrained PCB layouts where board-to-housing clearance is limited.
| Item number | BU01-10028015G-SY |
|---|---|
| Thickness | 0.1 mm |
| Width | 1.0 mm ± 0.2 |
| Length | 2.8 mm ± 0.2 |
| Height | 1.5 mm ± 0.2 |
| Basic Material | Beryllium Copper (BeCu) |
| Plating | Gold-plating |
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Standardly, SMD springs are gold-plated. Other plating are possible: G = Gold-plated S = Tin-plated |
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Contact us for product samples, datasheets, dimensions and pricing for Type U - 01.
