Type 8-04 SMD spring contact for PCB surface mount grounding and EMI shielding applications. The Precision-formed spring geometry provides consistent contact force for reliable EMI suppression — suitable for shielding cans, RF modules, and PCB-to-enclosure grounding.
Tape-and-reel packaged for automated SMT pick-and-place — compatible with standard reflow soldering processes and production lines.
Type 8 spring profile delivers reliable electrical contact between PCB pad and metal enclosure for consistent EMI suppression performance.
Provides a low-resistance grounding path from PCB to chassis or housing — consistent contact force maintained across the service life.
Precision-formed spring geometry ensures consistent contact force against the mating surface for reliable electrical continuity.
Type 8 geometry suited to space-constrained PCB layouts where board-to-housing clearance is limited.
Contact us for the full product datasheet including dimensions, contact force specification, material and plating details.
Contact us for product samples, datasheets, dimensions and pricing for Type 8 - 04.