SMD EMI spring contacts — also known as spring fingers or shield fingers — are surface-mountable components used to establish reliable, flexible connections in electronic devices. Their primary applications include EMI/RFI shielding, PCB-to-chassis grounding, and antenna signal routing.
Provides a low-impedance path to discharge high-frequency electromagnetic noise, preventing interference between adjacent board-level components or between internal circuitry and external metal enclosures.
Acts as a spring-loaded grounding contact that bridges the gap between the printed circuit board and a metal frame, shielding can, or external casing — accommodating thermal expansion and mechanical tolerance.
Used as antenna clips providing a stable, dynamic connection to feed signals — GPS, Wi-Fi, NFC, and cellular — to and from the PCB. The wiping action maintains conductivity despite vibration or thermal shift.
Safely discharges static electricity away from sensitive board areas. Particularly important for front-facing sensor modules, camera units, and TPMS wheel sensors exposed to triboelectric charge from road environments.
Facilitates low-voltage electrical connections between stacked PCBs or between the main board and peripheral devices such as speakers, microphones, and displays. Compliance absorbs relative movement without losing continuity.
Packaged in tape-and-reel formats, allowing for automated pick-and-place and standard SMT reflow soldering. Zero manual insertion — plug directly into existing SMT lines.
Endures thousands of compression cycles without losing contact force — accommodating thermal expansion, wiping and sliding actions, and mechanical vibrations across the product's entire service life.
Compact SMD footprint allows designers to maximise limited space inside handheld devices, automotive control units, and wearables — without sacrificing shielding or grounding performance.
Our engineering team can advise on the right spring contact form factor, material, and plating for your application — from prototype to production volumes.