C-type SMD spring contact for PCB surface mount grounding and EMI shielding. Tape-and-reel packaged for automated SMT pick-and-place assembly — reliable contact force with consistent electrical performance.
Tape-and-reel packaged for automated SMT pick-and-place — compatible with standard reflow soldering processes and production lines.
C-type spring profile delivers reliable electrical contact between PCB pad and metal enclosure for consistent EMI suppression performance.
Provides a low-resistance grounding path from PCB to chassis or housing — the spring returns the same contact force at a given working height, without taking a permanent set.
Precision-formed spring geometry ensures consistent contact force against the mating surface for reliable electrical continuity.
Low-profile C-type geometry suited to space-constrained PCB layouts where board-to-housing clearance is limited.
| Item number | BC11-25043035G-SY | BC11-25040050G-SY | BC11-25043050G-SY | BC11-20040053G-SY | BC11-20060060G-SY |
|---|---|---|---|---|---|
| Thickness | 0.1 mm | 0.1 mm | 0.1 mm | 0.1 mm | 0.1 mm |
| Width | 2.5 mm ± 0.2 | 2.5 mm ± 0.2 | 2.5 mm ± 0.2 | 2.0 mm ± 0.2 | 2.0 mm ± 0.2 |
| Length | 4.3 mm ± 0.2 | 4.0 mm ± 0.2 | 4.3 mm ± 0.2 | 4.0 mm ± 0.2 | 6.0 mm ± 0.2 |
| Height | 3.5 mm ± 0.2 | 5.0 mm ± 0.2 | 5.0 mm ± 0.2 | 5.3 mm ± 0.2 | 6.0 mm ± 0.2 |
| Basic Material | Beryllium Copper (BeCu) | Beryllium Copper (BeCu) | Beryllium Copper (BeCu) | Beryllium Copper (BeCu) | Beryllium Copper (BeCu) |
| Plating | Gold-plating | Gold-plating | Gold-plating | Gold-plating | Gold-plating |
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Standardly, SMD springs are gold-plated. Other plating are possible: G = Gold-plated S = Tin-plated |
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Contact us for product samples, datasheets, dimensions and pricing for TYPE C - 11.