C-type SMD spring contact for PCB surface mount grounding and EMI shielding. Tape-and-reel packaged for automated SMT pick-and-place assembly — reliable contact force with consistent electrical performance.
Tape-and-reel packaged for automated SMT pick-and-place — compatible with standard reflow soldering processes and production lines.
C-type spring profile delivers reliable electrical contact between PCB pad and metal enclosure for consistent EMI suppression performance.
Provides a low-resistance grounding path from PCB to chassis or housing — the spring returns the same contact force at a given working height, without taking a permanent set.
Precision-formed spring geometry ensures consistent contact force against the mating surface for reliable electrical continuity.
Low-profile C-type geometry suited to space-constrained PCB layouts where board-to-housing clearance is limited.
| Item number | BC04-12023015G-SY |
|---|---|
| Thickness | 0.08 mm |
| Width | 1.2 mm ± 0.2 |
| Length | 2.3 mm ± 0.2 |
| Height | 1.5 mm ± 0.2 |
| Basic Material | Beryllium Copper (BeCu) |
| Plating | Gold Plating |
Contact us for product samples, datasheets, dimensions and pricing for TYPE C - 04.
